Parker Chomerics Thermal Interface & EMI Shielding Materials

Parker Chomerics THERM A GAP

Thermally Conductive Gap Filler Pads and Gels

Parker Chomerics THERM-A-GAP materials address thermal management challenges by providing reliable heat transfer between electronic components and heat sinks, especially where surface irregularities or variable gaps exist. These gap fillers are engineered to integrate into complex assemblies and support consistent system performance.

• Available as pre-cured, single-component gels or solid pads, these materials offer flexibility for integration into diverse assembly processes.
• Gel formulations are selected to minimize mechanical stress on sensitive components, supporting long-term reliability in demanding environments.
• Engineered to accommodate variable gaps across multiple components and a shared heat sink, supporting consistent thermal performance throughout the assembly.
• Pad variants deliver both thermal conductivity and electrical insulation, aligning with safety and regulatory requirements in electronic assemblies.
• Optional pressure-sensitive adhesive (PSA) streamlines installation and supports repeatable assembly processes.
• Reinforced constructions with polyimide or fiberglass are available to enhance tear and puncture resistance, supporting durability in production and field service.

Parker Chomerics CHO THERM

Thermally Conductive Electrical Insulator Pads

Parker Chomerics CHO-THERM materials are engineered to deliver effective heat transfer while maintaining electrical isolation between components and heat sinks. These pads support compliance with electrical safety standards and system reliability.

• Dielectric insulating pads serve as a clean, consistent alternative to greased mica insulators, reducing variability in assembly and maintenance.
• Applied between power devices and heat sinks, these materials are specified to ensure reliable thermal and electrical performance in high-density assemblies.
• Available in low-modulus silicone and non-silicone formulations to address a range of application requirements and material compatibility needs.
• Suitable for managing large or variable thermal gaps in semiconductor assemblies, supporting consistent performance across production runs.

Parker Chomerics CHO SEAL

Electrically Conductive Elastomer EMI Gaskets

Parker Chomerics CHO-SEAL elastomer gaskets provide electrically conductive sealing for EMI shielding, environmental protection, and corrosion resistance in electronic enclosures. These solutions are specified to meet demanding operational and regulatory requirements.

• CHO-SEAL materials are available as sheet stock, extrusions, molded gaskets, and custom configurations to support integration into a wide range of enclosure designs.
• These gaskets combine electrical conductivity with robust elastomeric sealing, supporting both EMI performance and environmental protection.
• Specified for EMI shielding and environmental sealing in electronic housings, CHO-SEAL supports long-term reliability in critical applications.
• Cost effective solution for electronic shielding applications

Parker Chomerics CHO FORM

Form In Place (FIP) Electrically Conductive EMI Gaskets

Parker Chomerics CHO-FORM materials are engineered for robotic dispensing as form-in-place EMI shielding gaskets, enabling precise application in complex or small cross-section patterns.

• CHO-FORM supports automated, repeatable gasket application for high-volume or complex assemblies.
• Available in both conductive and non-conductive variants to address specific EMI and environmental sealing requirements.
• Designed for use in assemblies with complex geometries where traditional die-cut gaskets are not practical, supporting design flexibility.
• CHO-FORM can reduce total installed gasket cost by streamlining application and minimizing material waste.

Parker Chomerics SOFT SHIELD

Fabric Over Foam EMI Gaskets

Parker Chomerics SOFT-SHIELD gaskets are fabric-over-foam EMI shielding materials specified for applications where low closure force is required, supporting sensitive or lightweight assemblies.

• These gaskets combine conductive fabric or wire mesh with urethane foam to deliver EMI shielding and mechanical compliance.
• Supplied in strip and sheet stock.
• Engineered for low compression force requirements, SOFT-SHIELD supports consistent contact in applications with limited mechanical loading.
• Suitable for indoor EMI shielding and grounding, supporting compliance with electronic enclosure requirements.

Parker Chomerics SPRING LINE

Fingerstock EMI Shielding Gaskets

Parker Chomerics SPRING-LINE fingerstock gaskets deliver EMI shielding performance across a wide range of compression and accommodate variable mounting surfaces, supporting consistent electrical contact.

• SPRING-LINE offers metal fingerstock gasket solutions for applications requiring robust EMI shielding and mechanical resilience.
• Engineered to accommodate variability in mounting surfaces, these gaskets support reliable installation in diverse enclosure designs.
• SPRING-LINE maintains EMI shielding performance over large compression ranges, supporting long-term reliability in dynamic environmentss.
• Commonly used where consistent contact pressure is difficult to control